[발표초록]3.4 Preparation and Application of Latent Curing Epoxy Adhesive_충북대학교 화학과 신재섭 교수 > IACC 2019

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[발표초록]3.4 Preparation and Application of Latent Curing Epoxy Adhesive_…

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작성자 최고관리자 작성일19-10-18 09:09 조회2,102회 댓글0건

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강사명

 

충북대학교 화학과 신재섭 교수


발표제목(Title)

 

Preparation and Application of Latent Curing Epoxy Adhesive

 

발표요약(Abstract)

 

Anisotropic conductive film (ACF) is an essential component in the manufacture of liquid crystal displays (LCD), and an imidazole–epoxy resin system that exhibits a latent behavior is generally used as an adhesive in the ACF. In this seminar, the various latent curing systems for epoxy resin are introduced, for example microencapsulated imidazole, sulfonium salts, and protected imidazole. The various microencapsulation methods are also introduced. The characteristics of each method will be explained fully. The future application of the latent curing epoxy adhesive will be also mentioned.

 

 

Epoxy adhesive, Latent curing, microencapsulation, imidazole, curing mechanism

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