주제: Octopus-Inspired Smart Adhesive Pads ​

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Smart adhesives which stick to and release from a surface on demand have potential applications in skin-attachable wearable devices, smart-printing processes, medical adhesives, and industrial assembly systems. By mimicking the cavity-pressure-induced adhesion of octopus suckers, here we demonstrate smart adhesive pads, where thermo-responsive actuation of a hydrogel layer on elastomeric microcavity pads enables excellent switchable adhesion in response to a thermal stimulus. The smart adhesive pad exhibits an adhesive strength of 94 kPa and an adhesion switching ratio of ~293 in response to temperature change between 22 and 61 °C for repeated cycles. As a proof-of-concept application, the smart adhesive pads have been employed in the transfer printing of semiconductor micro- and nanomembranes onto arbitrary substrates to fabricate heterogeneously integrated semiconductor devices. The smart-printed InGaAs transistors on Si substrates exhibit an excellent field-effect mobility (~2026 cm²·V^-1s^-1) and on/off current ratio (~4 × 10³), which are among the best for heterogeneous InGaAs transistors, demonstrating the high efficiency of our smart-printing technique. The bioinspired smart adhesive system suggested in this study is also applicable to the heterogeneous integration of arbitrary micro-/nanoscale objects, which has a great potential in the fabrication of high-performance transistors and optoelectronic devices on heterogeneous or flexible substrates. Our smart adhesive pads provide a robust platform for applications in wearable devices, medical adhesives, and assembly of micro- and macro-scale objects in industrial manipulation systems.