Epoxy resins are one of the most representative thermosetting resins that are widely used in various

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fields, such as coatings, composites, adhesives, and electronics. Recently, there has been an

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increasing demand for utilizing high performance epoxy resins for electronic applications.

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Electronic products are small, thin, and lightweight, and exhibit high speed and high functionality.

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The growing demands for devices that are highly integrated and operate under high frequencies

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electronics have accelerated efforts to develop epoxy resin for high electric insulation, which is

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typically evaluated in terms of the dielectric constant (Dk) and low dissipation (Df) values.

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Therefore this seminar would be presented the electrical properties and design of chemical structure

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among epoxy resins to achieve relevant demands and requirements.