Latent Curing Epoxy Adhesive

In this presentation two kinds of latent curing epoxy adhesive will be introduced. One is the dicyandiamide-based epoxy adhesive (DBEA) and second is the imidazole-based epoxy adhesive (IBEA). DBEA was prepared for electronic board adhesion. The initiation temperature of DBEA was controlled with an accelerator to 100 ℃. IBEA was prepared by using encapsulation technique with polycaprolactone. IBEA was prepared for anisotropic conductive film (ACF). The used encapsulation techniques were solvent evaporation method and spray-drying method. Solvent evaporation method showed the better latent character than spray-drying method.      

Keywords: Latent curing, Epoxy adhesive, Dicyandiamide, Encapsulation, Imidazole